[position statement]

1. Responsible for the development and maintenance of P VD and CVD processes;

2. Responsible for the analysis, adjustment and control of QC data, and formulate the reaction and processing process for QC abnormalities;

3. Participate in the flow sheet, responsible for the positioning and analysis of abnormal process in the process of the flow sheet, put forward rectification and implement measures;

4. Cooperate with other module to locate product abnormalities, solve abnormalities, optimize the process, and improve the yield;

5. Responsible for compiling process specification documents, and conducting skill training for technicians and operators.

[job requirements]

1. Major in semiconductor microelectronics and materials;

2. Master icient semiconductor manufacturing process;

3. Strong ability of data analysis and abnormal positioning;

4. Active, active, careful, responsible, stress-resistant, and good teamwork ability.

[position statement]

1. Formulate asset procurement plans and implement the procurement of production-related materials;

2. Responsible for the development, evaluation, certification of new suppliers, and business negotiations with suppliers;

3. Responsible for the adjustment and management of problems arising in the cooperation with suppliers;

4. Responsible for the signing and management of procurement contracts, and cooperate with the financial department to manage accounting transactions;

5. Classified and organize the management of warehousing and storage;

6. Assist in administrative and logistics affairs;

7. Complete other affairs assigned by the superior and deal with emergencies.

[job requirements]

1. Familiar with procurement, warehouse management and logistics affairs processes;

2. Strong communication skills, strong execution ability and strong principle;

3. Proficient in using Word, EXCEL and other office software;

4. Experience in administrative and logistics management;

5. Administrative procurement experience in semiconductor industry and scientific research units is preferred, and military background is preferred.

[position statement]

1. Responsible for the development of new product process, design process flow and parameters;

2. Participate in flow sheet, responsible for the positioning and analysis of abnormal process in the process of flow sheet, put forward rectification and implement measures;

3. Responsible for the analysis, adjustment and control of QC data, and formulate the reaction and processing process for QC abnormalities;

4. Responsible for WAT data analysis, coordinating with related module to locate, solve abnormalities, optimize process and improve yield;

5. Responsible for compiling process specification documents, and conducting skill training for technicians and operators.

[job requirements]

1. Major in semiconductor microelectronics and materials;

2. Master icient semiconductor manufacturing process;

3. More than 2 years of P I E working experience, PVD, CVD process experience is preferred;

4. Strong ability of data analysis and abnormal positioning;

5. Active, active, careful, responsible, anti-pressure, and good teamwork ability.

[position statement]

1. Responsible for the quality control in the process of chip manufacturing and packaging, and put forward improvement suggestions, and constantly optimize and improve the process;

2. Analyze various failures in the process of product design, manufacturing and application, and prepare failure analysis reports;

3. Timely track, feedback and close the quality problems caused by suppliers;

4. Responsible for new supplier development review and quality system evaluation;

5. Analyze and coordinate to deal with quality anomalies, constantly promote internal quality improvement, and meet customer requirements;

6. Responsible for C P and F T test, preliminary collation, analysis and summary of data, and output report.

[job requirements]

1. Bachelor degree or above in science or engineering;

At least 2.2 years' experience in production line quality management;

3. Have theoretical knowledge of quality management, be familiar with ISO9000 and IATF16949 quality system;

4. Rich experience in field management, familiar with quality management techniques;

5. Active, active, careful, responsible, anti-pressure, and good teamwork ability.

[position statement]

1. Familiar with ceramic packaging CLCC, CPGA process, familiar with gas-tight packaging process, formulate and implement technical plans;

2. Design the packaging shell structure with the chip design engineer;

3. Familiar with WB, DB, brazing, parallel seam welding process, DOE process debugging, and complete the technical report;

4. Formulated the packaging process and processing standards, completed and improved the quality requirements documents, and participated in the corresponding evaluation;

5. Analyze the operation data, conduct technical communication with relevant outsiders, conduct FA analysis, and solve the abnormalities;

6. Actively expand the packaging forms suitable for the new product development needs, and develop new suppliers and outsiders;

7. Identify and control outsiders according to the requirements of ISO9000 quality system.

[job requirements]

1. Bachelor degree or above in science or engineering;

2. Knowledge of integrated circuit packaging and production line experience, especially familiar in the field of ceramic packaging or wafer level packaging, and working experience in related packaging enterprises is preferred;

3. Good foreign language, skilled in reading professional foreign language materials and communicating;

4. Excellent team cooperation ability, stable personality, with a certain ability to resist pressure.

[position statement]

1. Formulate process plans and develop new processes according to the requirements;

2. Stabilize the curing process, and write the process operation instructions;

3. Optimize and improve the process capability, conduct failure analysis, and improve the product yield;

4. Solve daily online process anomalies, and complete analysis reports and related documents;

5. SPC analysis of daily monitoring data, and abnormal early warning process;

6. Responsible for the training of production line operators;

7. Contact and contacts between lithography regional consumables manufacturers, chemicals / material suppliers, etc.

[job requirements]

1. Major in semiconductor microelectronics and materials;

2. Master icient semiconductor manufacturing process;

3. At least 3 years working experience in lithography process, with infrared thermal imaging experience is preferred;

4. Active, active, careful, responsible, stress-resistant, and good teamwork ability.

[position statement]

1. Responsible for the optimization of the company's business process and system;

2. Responsible for the follow-up and management of commercial contracts, including contract drafting, review, signing, progress tracking, delivery coordination, project payment collection, etc.;

3. Understand the needs of potential customers, and coordinate the internal resources of the company to provide professional services to customers;

4. Responsible for maintaining customer relations, timely collecting customer, competitors and project information, conducting systematic analysis of customer groups, and providing constructive opinions;

5. Responsible for assisting the department manager to complete business-related work.

[job requirements]

1. Bachelor degree or above, 5 years or above related work experience, business administration, marketing or secretarial major is preferred;

2. Familiar with business process, proficient in contract law and business contract practice;

3. Excellent communication, negotiation and coordination ability, project planning ability and scheme writing ability;

4. Careful and serious work, strong sense of responsibility, good sense of teamwork and ability to resist pressure.

5. Serious, responsible, proactive, with a good sense of cooperation, and strong ability to resist pressure; (a personal design case is required);

6. Understand consumers and take user experience-centered design thinking.

[position statement]

1. Complete the sales tasks in the responsible area;

2. Develop regional / key customer partners;

3. Expand the marketing network, establish a cooperative relationship with customers, and maintain customer service and customer relationship;

4. Responsible for assisting in completing marketing, sales, service and other work, analyzing sales trends, and putting forward improvement plans according to market changes;

5. Properly handle the relevant problems raised by users, ensure the good reputation of the company's first-class service, and constantly enhance the company's brand influence;

6. Write marketing analysis reports and provide advice to management.

[job requirements]

1. Bachelor degree or above, major in marketing, information or electronics;

2. Familiar with the marketing management process;

3. Strong organization, planning, coordination, interpersonal skills and communication skills;

4. Strong customer communication skills and business processing skills;

5. Love sales and desire success, proactive, quick action, and good team spirit.

[position statement]

1. Responsible for FPGA type selection, new function prediction, algorithm optimization, chip performance analysis, image processing and other work;

2. Design and implementation of image processing algorithm based on FPGA;

3. Design algorithms, build models according to business requirements, and continuously optimize and improve them;

4. Cooperate with the team to further optimize the FPGA implementation algorithm;

5. Assign the sub-tasks according to the overall project, design the detailed scheme and write it into the document.

[job requirements]

1. Computer, computer, automation, communication, mathematics and other related majors, master's degree or above is preferred, bachelor can also be considered;

2. Experience in video image processing, image enhancement, noise reduction and feature detection technology;

3. Proficient in matlab application, solid verilog foundation, skilled in xilinxFPGA application, microsemi FPGA and GOWIN FPGA development experience is preferred;

4. Excellent coding habits and strong design, development and debugging ability;

5. Strong exploration and innovation ability, logical thinking ability and learning ability;

6. Good communication skills and teamwork skills.

[position statement]

1. Cooperate with the Marketing Department to complete the initial definition of the project, and participate in the project technical feasibility study and project approval;

2. Complete the scheme according to the overall needs of the project, refine the scheme, and complete the feasibility scheme verification and detailed scheme design;

3. Design specific circuit architecture according to product definition and technical specifications, complete chip selection, schematic diagram and PCB design;

4. Assist FPGA engineers and software engineers to conduct product joint adjustment and solve related problems;

5. Responsible for the single machine test before product finalization, complete the preparation of the test outline, track the test progress, and improve the design according to the test results;

6. Responsible for writing the relevant design documents.

[job requirements]

1. Major in electronics, 3 years master, 5 years undergraduate experience in hybrid circuit design;

2. Proficient in holding one or more of EDA tools such as Cadence and PADS, competent for hardware circuit design of complex high-speed electronic system, with GHZ high-speed circuit design experience;

3. Familiar with high-performance multi-core PowerPC, ARM, TI DSP processor hardware circuit design, rich experience in CPU peripheral circuit development, competent for board-level circuit design and BOOT program debugging;

4. Familiar with Xilinx and Altrea series high-performance FPGA circuit design, with rich experience in FPGA circuit development, and competent for circuit design and board-level hardware debugging;

5. Familiar with digital-analog hybrid design, with experience in sensor, A DC, operation and discharge circuit design;

6. Good team cooperation ability, communication skills, learning ability and professional dedication.